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Ceramics Printed Circuit Boards

RMT Ltd provides full service with single and double-sided ceramics PCB and substrates manufacturing。 The technology is developed and patented by RMT Ltd company。 Company know-how allow to manufacture high quality ceramics substrates and PCB on Al2O3 and AlN materials。 The key advantages are in precision patterns, high-quality processing, excellent solderability and bondability with single- and double-side metallized ceramics processing。

RMT patented technology provides significant advantages over typical thin- and thick-film metallization processes. Single and double-sided ceramics PCBs have better quality, higher resolution, high conductivity, excellent solderability and bonding properties.

RMT provide fast development and manufacturing of metallized ceramics substrates and ceramics PCBs for LD applications, optoelectronics industry, high-frequency and other applications.

Click to enlarge. Fig.1 - RMT technology Metallization Structure (click to zoom)Click to enlarge.
Fig.2 - Ceramics PCB with VIAS
(click to zoom)

Ceramics Processing & Services



Click to enlarge. Click to enlarge. Click to enlarge.
Various shape ceramics cuttingVarious holes ceramics cuttingDouble-side metallization process
Click to enlarge. Click to enlarge. Click to enlarge.
Precise customized Au patternsVarious ceramics thicknessesTrial and volume manufacturing

Parameter

Ceramics Material

Units

Comments

Al2O3(100%)

Al2O3(96%)

AlN(100%)

General dimensions

Substrate footprint, max

60.0 x 48.0

mm

Default*

Substrate thickness

0.15;  0.25;  0.5;  0.63;  1.0

mm

Default*

Substrate surface




- polished

Ra < 0.1

um


- lapped

Ra < 0.4

um


Pattern properties

Stripe width, min 

0.1

mm


Between stripes, min 

0.1 (0.05*)

mm


Metallization adhesion

> 5

 > 3

> 3

kg/mm2


Double-sided metallization

+



Via-holes diameter, minimum  

0.2

mm


Alignment accuracy

20

um

For double-sided patterns

Metallization

Adhesion layer, Cr (Ti)

< 0.1

um

Magnetron sputtering

Conductive layer, Сu

20 - 25

um

Magnetron sputtering

Barrier layer, Ni

3 - 4

um

Chemical deposition

Finishing layer, Au

0.2 - 0.3

um

Chemical deposition

Processing

Laser disc dicing

+



Laser cutting/scribing

+



VIAS

+


Laser drilling

* Parameters may be adjusted by request


RMT provide full service with Au patterned ceramics substrates (and ceramics PCB) development, prototyping and manufacturing. For additional info and requests, please, contact us directly.

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